The International Solid State Circuits Conference new products lacking in numbers but not innovation
This is the place where we will bring you fresh content relating to IT news!
December Issue, day 29, 2011
The International Solid State Circuits Conference, which will take place in San Francisco in from February 19th through to the 23rd is expected to have low numbers of server class processers exhibited. There is however interest in the IT products showing with them- specifically the system-on-chip and memory technologies. Large IT companies are expected to show off their newest and most advanced technologies. Exhibitors are coming from Oracle, IBM and Intel. Other names are making a contribution as well. Stacked chips are common among the displays. The University of Michigan is expected to attend- with a 7 layered 3D chip that has 256MB of stacked DRAM. Korea Advanced Institute of Science and Technology, is also showing off a stacked chip- it is a tiny chip in comparison to its performance capabilities.